Series 400

Features

  • footprint: 1108
  • size: 3.0 x 2.0 x 1.0 mm
  • circuit substrate: Al2O3 Ceramics
  • for mid power applications
  • chip materials: AlInGaP; GaAlAs, InGaN, InGaAlN and GaN
  • lead free solderable, soldering pads: gold plated
  • devices are RoHS and REACH confom
Series 400 - conversion / broad band
Part No. Wavelength Forward Current Intensity
OCL-400 GE545 545 nm 20 mA 900 mcd
Series 400 - white
Part No. Wavelength Forward Current Intensity
OCL-400 SWW - 20 mA 500 mcd
OCL-400 SW - 20 mA 650 mcd
OCL-400 OWT 5000 K 20 mA 350 mcd
Series 400 - ultraviolet
Part No. Wavelength Forward Current Intensity
OCU-400 UB355 353 nm - 360 nm 20 mA 0,45 mW/sr
OCU-400 UB365 363 nm - 370 nm 20 mA 0,78 mW/sr
OCU-400 UE365 365 nm - 370 nm 20 mA 3,5 mW/sr
OCU-400 UC375 375 nm - 380 nm 20 mA 2,1 mW/sr
OCU-400 UD380 380 nm - 385 nm 20 mA 3,4 mW/sr
OCU-400 UE390 390 nm - 395 nm 20 mA 6 mW/sr
OCU-400 UE400 400 nm - 405 nm 20 mA 6 mW/sr
OCU-400 UE410 410 nm - 415 nm 20 mA 6 mW/sr
OCU-400 UE415 415 nm - 420 nm 20 mA 6 mW/sr
OCU-400 UE420 420 nm - 425 nm 20 mA - mW/sr
OCU-400 UE430 425 nm - 435 nm 20 mA 4,85 mW/sr
Series 400 - visible
Part No. Wavelength Forward Current Intensity
OCL-400 BE460 460 nm 20 mA 300 mcd
OCL-400 GC525 525 nm 20 mA 450 mcd
OCL-400 MY 589 nm 20 mA 400 mcd
OCL-400 MSD 624 nm 20 mA 400 mcd