Series 400

Features

  • footprint: 1108
  • size: 3.0 x 2.0 x 1.0 mm
  • circuit substrate: Al2O3 Ceramics
  • for mid power applications
  • chip materials: AlInGaP; GaAlAs, InGaN, InGaAlN and GaN
  • lead free solderable, soldering pads: gold plated
  • devices are RoHS and REACH confom
Series 400 - conversion / broad band
Part No. Wavelength Forward Current Intensity
OCL-400 GE545 545 nm 20 mA 900 mcd
Series 400 - white
Part No. Wavelength Forward Current Intensity
OCL-400 SWW 2,600 - 4,000 K 20 mA 500 mcd
OCL-400 SW 5,500 - 12,000 K 20 mA 650 mcd
OCL-400 OWT 5,500 - 12,000 K 20 mA 350 mcd
Series 400 - ultraviolet
Part No. Wavelength Forward Current Intensity
OCU-400 UB355 353 - 360 20 mA 0.45 mW/sr
OCU-400 UB365 363 - 370 20 mA 0.78 mW/sr
OCU-400 UE365 365 - 370 20 mA 3.50 mW/sr
OCU-400 UC375 375 - 380 20 mA 2.10 mW/sr
OCU-400 UD380 380 - 385 20 mA 3.40 mW/sr
OCU-400 UE390 390 - 395 20 mA 6.00 mW/sr
OCU-400 UE400 400 - 405 20 mA 6.00 mW/sr
OCU-400 UE410 410 - 415 20 mA 6.00 mW/sr
OCU-400 UE415 415 - 420 20 mA 6.00 mW/sr
OCU-400 UE420 420 - 425 20 mA ------ mW/sr
OCU-400 UE430 425 - 435 20 mA 4.85 mW/sr
Series 400 - visible
Part No. Wavelength Forward Current Intensity
OCL-400 BE460 460 20 mA 300 mcd
OCL-400 GC525 525 20 mA 450 mcd
OCL-400 MY 589 20 mA 400 mcd
OCL-400 MSD 624 20 mA 400 mcd